| 摘要 |
The present invention provides a thin film manufacturing method for improving a production volume by predicting expansion of a hole defect or a crack on a substrate and preventing the substrate from tearing. The thin film manufacturing method includes the steps of: depositing a deposition material on a surface of the substrate in a deposition region to form a thin film while carrying out take-up travel of the substrate between a first roll and a second roll; irradiating a predetermined portion of the surface of the substrate with an electromagnetic wave or a particle beam at a location in front of the deposition region and/or a location behind the deposition region between the first roll and the second roll and detecting the electromagnetic wave or particle beam, which has been transmitted through the substrate or reflected by the substrate; storing information regarding the detected electromagnetic wave or particle beam and the predetermined portion; determining based on the detected electromagnetic wave or particle beam whether or not a defect of the substrate at the predetermined portion is increasing; and carrying out an operation of preventing the substrate from tearing, in accordance with a determination result of the determining step.
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