SUBSTRATE POLISHING APPARATUS AND METHOD OF POLISHING SUBSTRATE USING THE SAME

摘要

PURPOSE: An apparatus and a method for polishing substrates are provided to improve the polishing efficiency of the substrates by measuring the worn degree of the upper side of a pad supporting unit. CONSTITUTION: A substrate(70) is loaded on a substrate support unit. The polishing unit(300) includes a polishing pad(311) polishing the substrate and a pad driving unit. The pad driving unit moves the polishing pad in order to change the relative position of the polishing pad. A pad supporting unit(401) includes a thickness detecting unit(441) measuring the worn degree of the upper side the polishing pad. The pad supporting unit includes a supporting body(410) installed at one side of the substrate support unit and a supporting pad(424).