ANTI-STATIC MOLD PROCESSING FILM FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A film for a semiconductor package molding process with an antistatic property is provided to protect a lead and a terminal from a molding resin by masking the exposed parts of the lead and the terminal during a molding process. CONSTITUTION: A conductive layer(9) is coated on one side of a base film(1). A conductive layer formed on the base film is composed of conductive polymer. An adhesion layer(2) is spread on the conductive layer. The thickness of the adhesion layer is between 20 and 30um. The releasing property, the heat resistance property, and the durability are applied to the adhesion layer using an ultraviolet curing technique.