发明名称 PACKAGE FOR LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURING LIGHT EMITTING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a package for a high-output light emitting element at a low cost that has high optical reflectance that is not degraded by high temperature or ultraviolet irradiation and is superior in heat radiation and resistant to compression pressure. <P>SOLUTION: Resin or ceramics is used for a material of the package for a light emitting element. However, the resin is weak for heat and it is discolored by ultraviolet ray, and the ceramics has low reflectance and it is expensive. Furthermore, a package made of resin or ceramics tends to crack or break because of mechanical tightening attachment such as screwing or the like. A metal substrate is adhered to a metal plate provided with a through-hole having tapered optical reflection surface as a reflector, with an insulation layer in between, thereby attaining a package for a light emitting element. In addition, a plurality of light emitting elements are assembled at the same time by using the package, and then they are divided into light emitting elements with predetermined size, so that a light emitting element with high productivity is attained at a low cost. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011035264(A) 申请公布日期 2011.02.17
申请号 JP20090181652 申请日期 2009.08.04
申请人 ZENIYA SANGYO KK 发明人 NIIKURA IKUO
分类号 H01L33/62;H01L23/28 主分类号 H01L33/62
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