发明名称 COMPOUND SURFACE GRINDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a compound surface grinding device that can reduce the grinding processing time for a grinding object. SOLUTION: In a compound surface grinding device 1 that includes an ultrasonic transmitter 49, the grinding object is placed on a worktable 31 reciprocating right and left, and the surface of the grinding object faces a vertical plane that includes a central point 31c of the worktable, a diametrical direction of a rough grinding wheel 26a and a diametrical direction of a finishing grinding wheel 26b in which the grinding wheels 26a, 26b are placed so that the central point 31c of the worktable is positioned at an equal distance from a central point 25a of the rough grinding wheel and a central point 25b of the finishing grind wheel, the central point of the worktable being a standby position for a grinding process start. Since the grinding wheels are not required to be exchanged and chips generated between the grinding object and the grinding wheels are easily detached by ultrasonic vibration of a grinding wheel spindle, a process time can be reduced. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011031371(A) 申请公布日期 2011.02.17
申请号 JP20090183030 申请日期 2009.08.06
申请人 OKAMOTO MACHINE TOOL WORKS LTD 发明人 KOBAYASHI HISASHI;TSUCHIYA KEIJI;KANBE TORU
分类号 B24B7/02;B24B41/047 主分类号 B24B7/02
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