发明名称 ELECTROLESS PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electroless plating method in which a plurality of sheet substrates are stored in a rack, each rack is immersed in liquid chemical for processing, and any irregular plating caused by insufficient liquid draining is not generated. SOLUTION: In the electroless plating method, air is fed from an air-blowing mechanism 300 to a substrate surface substantially parallel thereto when at least two or more substrate arranged in a substantially uniform manner are pulled up from a liquid chemical substantially orthogonal to the liquid chemical surface after a rack 200 storing a plurality of sheet substrate 100 is immersed in the liquid chemical. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011032538(A) 申请公布日期 2011.02.17
申请号 JP20090180378 申请日期 2009.08.03
申请人 TORAY IND INC 发明人 TAKEUCHI NANA;FUJI NOBUO
分类号 C23C18/16 主分类号 C23C18/16
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