发明名称 METHOD FOR MANUFACTURING METAL FOIL WITH PATTERN FORMED THEREON, METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTOR LAYER PATTERN, AND CONDUCTIVE SUBSTRATE FOR PLATING AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing patterned metal foil by which various types of fine-patterned metal foil can be produced. SOLUTION: The method for manufacturing metal foil with a pattern formed on at least one side thereof, includes the steps of: (A) precipitating metal by plating on a conductive surface of a conductive substrate for plating in which a recess is formed on the surface, the recess being formed so as to widen toward the opening direction; and (B) releasing the metal precipitated on the surface of the conductive substrate for plating. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011032522(A) 申请公布日期 2011.02.17
申请号 JP20090179083 申请日期 2009.07.31
申请人 HITACHI CHEM CO LTD 发明人 SUZUKI KYOSUKE;NAOYUKI SUSUMU
分类号 C25D1/04;C23C18/31;C25D1/10 主分类号 C25D1/04
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