发明名称 |
METHOD FOR MANUFACTURING METAL FOIL WITH PATTERN FORMED THEREON, METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTOR LAYER PATTERN, AND CONDUCTIVE SUBSTRATE FOR PLATING AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing patterned metal foil by which various types of fine-patterned metal foil can be produced. SOLUTION: The method for manufacturing metal foil with a pattern formed on at least one side thereof, includes the steps of: (A) precipitating metal by plating on a conductive surface of a conductive substrate for plating in which a recess is formed on the surface, the recess being formed so as to widen toward the opening direction; and (B) releasing the metal precipitated on the surface of the conductive substrate for plating. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011032522(A) |
申请公布日期 |
2011.02.17 |
申请号 |
JP20090179083 |
申请日期 |
2009.07.31 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
SUZUKI KYOSUKE;NAOYUKI SUSUMU |
分类号 |
C25D1/04;C23C18/31;C25D1/10 |
主分类号 |
C25D1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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