An avionics chassis comprises a housing having a substantially thermally non-conductive frame comprising a composite of carbon fibers laid up in an epoxy matrix. The housing also includes at least two walls, at least one of which is a thermally conductive wall comprising a composite of carbon fibers in a carbonized matrix, and a plurality of spaced, thermally-conductive, card rails provided on the at least two walls. The at least two walls are mounted to the frame in opposing relationship such that corresponding card rails on the walls define an effective slot therebetween in which a printed circuit board may be received and the card rails and the at least one thermally conductive wall form a thermally conductive path from the interior to the exterior.
申请公布号
WO2011019420(A2)
申请公布日期
2011.02.17
申请号
WO2010US33721
申请日期
2010.05.05
申请人
GENERAL ELECTRIC COMPANY;VANDER PLOEG, BENJAMIN, JON;STEENWYK, MEREDITH, MARIE;COXON, DANNY, WELDON;STREYLE, JOHN, JAY
发明人
VANDER PLOEG, BENJAMIN, JON;STEENWYK, MEREDITH, MARIE;COXON, DANNY, WELDON;STREYLE, JOHN, JAY