| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device that is inexpensive and more reliable by reinforcing bonding between a lead portion and a resin portion while suppressing a decrease in luminance of a light emitting element by preventing resin burrs from being formed on a reflecting surface. <P>SOLUTION: The light emitting device includes a light emitting diode chip 2 and a first lead terminal 10 in which: a bottom portion including a mounting region of the light emitting diode chip 2 is formed; an internal surface functioning as the reflecting surface for light emitted by the light emitting diode chip 2; and a side wall connected with the bottom portion is continuously formed. The light emitting device also includes a second lead terminal 20 provided apart from the first lead terminal 10. The light emitting device further includes the resin portion 3 supporting the first lead terminal 10 and second lead terminal 20, and having a cavity 6 for exposing a part of the second lead terminal 20 and a mounting region of the first lead terminal 10. <P>COPYRIGHT: (C)2011,JPO&INPIT |
