发明名称 DESIGN SUPPORT PROGRAM, DESIGN SUPPORT DEVICE, AND DESIGN SUPPORT METHOD
摘要 PROBLEM TO BE SOLVED: To reduce the temperature of locally hot areas. SOLUTION: A design support apparatus acquires thermal analysis results, having an area 1 having a predetermined temperature or higher in layout data 100 on a circuit being designed and analysis results of paths in the layout data 100. An arbitrary cell on a noncritical path among cells placed inside the area 1 is designated as a target cell for reducing the temperature of the area 1, and the decision result is output. The designated target cell is then subjected to process of temperature reduction. A resistive element is connected to the output of the target cell. Alternatively, the placement position of the target cell is relocated away from the area 1, or the cell type of the target cell is changed to a cell type having a lower power consumption value. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011034489(A) 申请公布日期 2011.02.17
申请号 JP20090182364 申请日期 2009.08.05
申请人 FUJITSU SEMICONDUCTOR LTD 发明人 HINO TOSHIO;SAKATA TAKESHI;YAMADA TOMOYUKI
分类号 G06F17/50;H01L21/82;H01L21/822;H01L27/04 主分类号 G06F17/50
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