| 摘要 |
PURPOSE: A semiconductor package including a bonding member is provided to reduce the manufacturing cost by simplifying the manufacturing process of a semiconductor package by allowing the conductive wire or the lead frame to play the role of rearranging wire of wafer level package. CONSTITUTION: A semiconductor chip(10) comprises a first side, a second side(2) facing the first side, and a side(3). The semiconductor chip comprises a bonding pad(4) arranged on the first side. A molding material(20) covers the first side of the semiconductor chip. A bonding member(30) comprises a first end(32) electrically connected to the bonding pads and a second end(34). |
