发明名称 Halbleiterpackage mit eingebetteter magnetischer Komponente und Verfahren zur Herstellung
摘要 <p>A printed circuit board (PCB) substrate which can be used in a semiconductor package, such as BGA and LGA, has a top surface and a bottom surface. A magnetic component includes a laterally extending bottom plate, two or more vertically extending posts, and a laterally extending top plate, wherein the bottom plate is fully embedded within the PCB substrate and the two or more posts extend in the PCB substrate from the bottom plate toward the upper surface of the PCB substrate. The top plate contacts an end of each of the two or more posts along the top surface of the PCB substrate.</p>
申请公布号 DE112009000686(T5) 申请公布日期 2011.02.17
申请号 DE20091100686T 申请日期 2009.03.23
申请人 ASIC ADVANTAGE INC. 发明人 FURNIVAL, COURTNEY R.
分类号 H05K1/18;H01L23/12 主分类号 H05K1/18
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