发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERN CURED FILM AND ELECTRONIC PARTS
摘要 <P>PROBLEM TO BE SOLVED: To provide a high-sensitivity positive photosensitive resin composition reduced in exposure time. <P>SOLUTION: The positive photosensitive resin composition includes (a) a polymer having a structure represented by formula (I), (b) a naphthoquinonediazide compound, (c) a solvent, and (d) an iodonium compound, and satisfies either condition selected from the condition (i) and the condition (ii). The condition (i) is that the iodonium compound of (d) has a frame of a polycyclic aromatic ring formed by two or more monocyclic aromatic rings being condensed. The condition (ii) is that the positive photosensitive resin composition includes (e) an optical pumping accelerator having a frame of a polycyclic aromatic ring formed by two or more monocyclic aromatic rings being condensed, together with the iodonium compound of (d). <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011033772(A) 申请公布日期 2011.02.17
申请号 JP20090179059 申请日期 2009.07.31
申请人 HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD 发明人 KOTANI SHINJI
分类号 G03F7/023;C08G69/32;G03F7/004;H01L21/027 主分类号 G03F7/023
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