| 摘要 |
PROBLEM TO BE SOLVED: To provide a pattern forming method using a lift-off method, in which burr does not occur around edges of a conductive pattern when the pattern forming method using a lift-off method is employed. SOLUTION: First, a groove 2 is formed within an area of a surface of a wafer substrate 1 where edges of a conductive pattern 6 are located. Next, a resist 3 having an opening 3a where the groove 2 is exposed is formed on the wafer substrate 1. Then, a conductive film 5 is formed on the wafer substrate 1 and the resist 3 exposed from the opening 3a. After that, the resist 3 is removed and the conductive pattern 6 is formed on the wafer substrate 1. COPYRIGHT: (C)2011,JPO&INPIT |
