| 摘要 |
PROBLEM TO BE SOLVED: To provide a measuring method of a displacement gauge for performing high-accuracy measurement, even when the displacement of a measuring object is measured through a translucent member provided on the surface of the measuring object. SOLUTION: The displacement gauge 1 emits light toward a semiconductor wafer 2 as a measuring object and receives light reflected by the semiconductor wafer 2 to measure the displacement of the semiconductor wafer 2. A planar dicing tape 3 having translucency is provided on the surface of the semiconductor wafer 2. When the displacement of the semiconductor wafer 2 is measured with the displacement gauge 1, a liquid 4 having a refractive index substantially the same as that of the dicing tape 3 is first applied to the surface of the dicing tape 3, and the displacement of the semiconductor wafer 2 is measured through the liquid 4 and the dicing tape 3. COPYRIGHT: (C)2011,JPO&INPIT
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