| 摘要 |
A computer-implemented image pattern matching method for wafer alignment is provided, for determining an overall similarity value and an overall geometry relationship between a target wafer image and a model wafer image. The method includes: determining a plurality of model patterns in the model wafer image; searching the target wafer image to identify a plurality of target patterns, thereby generating a plurality of matches each including a respective target pattern and model pattern; selecting, using multiple threshold values, ones of the plurality of matches according to a plurality of similarity values; and determining, using a predetermined algorithm and the selected ones of the matches, the overall similarity value and the overall geometry relationship between the target wafer image and the model wafer image.
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