发明名称 HEAT SINK FAST DISASSEMBLING STRUCTURE
摘要 A heat sink fast disassembling structure dissipates heat from a heat source through a heat sink includes a base installed on a electronic device and a bracing rack connecting to the base. The base has an opening corresponding to the heat source and a first positioning portion. The bracing rack has a fastening portion mounted onto the heat sink and a connecting portion connecting to the base. The connecting portion has a second positioning portion corresponding to the first positioning portion. The bracing rack and the base are interposed by an elastic element. The first and second positioning portions form an anchoring relationship through the elastic element. The heat sink is in contact with the heat source through the anchoring relationship and the connecting portion via the opening. The bracing rack can be installed or disassembled through the first and second positioning portions and the elastic element.
申请公布号 US2011035935(A1) 申请公布日期 2011.02.17
申请号 US20090539627 申请日期 2009.08.12
申请人 CHEN CHING-YUAN;YU PEN-CHUN 发明人 CHEN CHING-YUAN;YU PEN-CHUN
分类号 B23P19/00 主分类号 B23P19/00
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