SEMICONDUCTOR PACKAGE AND STACK SEMICONDUCTOR PACKAGE HAVING THE SAME

摘要

PURPOSE: A semiconductor package and a stacked semiconductor package having the same are provided to allow easy selection of a particular semiconductor out of the plurality of semiconductor packages by connecting the semiconductor package and the substrate with the conductive wire. CONSTITUTION: A semiconductor chip(10) has the shape of a plate with four edges. The semiconductor chip comprises a chamfering portion(12) formed on a first edge group and a circuit part. A data bonding pad(20) is electrically connected to the circuit part. A chip selection bonding pad(30) is arranged to be adjacent to a second edge group(4).