| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor cooler capable of effectively utilizing a part of a member, where a refrigerant flows, which is not in contact with a semiconductor module. SOLUTION: The semiconductor cooler includes a plurality of semiconductor modules 2 and a pair of cooling tubes 3a, 3b. The semiconductor modules 2 are arranged in two arrays. The individual cooling tubes 3 each have a first cooling portion 31 for cooling semiconductor modules 2 belonging to one array, a second cooling portion 32 for cooling semiconductor modules 2 belonging to the other array, and a connection portion 33 connecting the first cooling portion 31 and the second cooling portion 32 to each other. Then the pair of cooling tubes 3a, 3b come into directly or indirectly contact with each other at the connection portion 33 to exchange heat between refrigerants 4. COPYRIGHT: (C)2011,JPO&INPIT |
