COATING PROCESSING DEVICE, COATING PROCESSING METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To coat a substrate with a coating liquid uniformly in a substrate plane while performing uniform temperature control over the substrate in the substrate plane. SOLUTION: A resist coating device 20 is provided with a spin chuck 130 which holds and rotates a wafer W and freely moves in a vertical direction. A temperature control plate 140 for controlling the temperature of the wafer W is disposed below the wafer W held by the spin chuck 130. At a center part of the temperature control plate 140, an opening part 141 where the spin chuck 130 is arranged is formed. The temperature control plate 140 is divided into an outer temperature control plate 142 which controls a temperature of an outer peripheral part of the wafer W and an inner temperature control plate 143 which controls a temperature of an inner peripheral part of the wafer W. The outer temperature control plate 142 and inner temperature control plate 143 can control the temperatures of the outer peripheral part and inner peripheral part of the wafer W respectively and independently. COPYRIGHT: (C)2011,JPO&INPIT