发明名称 Method And Apparatus for Uniformly Implanting A Wafer With An Ion Beam
摘要 Initially, an ion beam is formed as an elongated shape incident on a wafer, where the shape has a length along a first axis longer than a diameter of the wafer, and a width along a second axis shorter than the diameter of the wafer. Then, a center of the wafer is moved along a scan path intersecting the ion beam at a movement velocity, and the wafer is rotated around at a rotation velocity simultaneously. During the simultaneous movement and rotation, the wafer is totally overlapped with the ion beam along the first axis when the wafer intersects with the ion beam, and the rotation velocity is at most a few times of the movement velocity. Both the movement velocity and the rotation velocity can be a constant or have a velocity profile relative to a position of the ion beam across the wafer.
申请公布号 US2011037000(A1) 申请公布日期 2011.02.17
申请号 US20090539558 申请日期 2009.08.11
申请人 ADVANCED ION BEAM TECHNOLOGY, INC. 发明人 SHEN CHENG-HUI;BERRIAN DON
分类号 H01J37/08 主分类号 H01J37/08
代理机构 代理人
主权项
地址