发明名称 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma processing apparatus and a plasma processing method capable of optimizing a flow of process gas according to a process condition or the like. <P>SOLUTION: The plasma processing apparatus 1 includes a control nozzle part 16 including a shaft part inserted into a wall surface of a processing container 2 and a diameter expansion part so formed on one end of a side of the shaft part as to face the inside of the processing container 2 and having a diameter size larger than the diameter size of the shaft part, a movement part 17 for changing the position of the diameter expansion part from the inner wall surface of the processing container 2, a control part 14 for controlling the movement part, and a gas supply part 12 for supplying process gas into the processing container 2 via the nozzle part. The control part controls a flow of process gas supplied along the outer periphery of the shaft part inserted into the wall surface of the processing container 2 by changing the position of the diameter expansion part from the inner wall surface of the processing container 2. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011035232(A) 申请公布日期 2011.02.17
申请号 JP20090181330 申请日期 2009.08.04
申请人 SHIBAURA MECHATRONICS CORP 发明人 ITA KOJI
分类号 H01L21/3065;H05H1/46 主分类号 H01L21/3065
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