发明名称 METHOD OF MANUFACTURING A Si(1-v-w-x)CwAlxNv SUBSTRATE, METHOD OF MANUFACTURING AN EPITAXIAL WAFER, Si(1-v-w-x)CwAlxNv SUBSTRATE, AND EPITAXIAL WAFER
摘要 There are provided a method for manufacturing a Si(1-v-w-x)CwAlxNv substrate having a reduced number of cracks and high processibility, a method for manufacturing an epitaxial wafer, a Si(1-v-w-x)CwAlxNv substrate, and an epitaxial wafer. A method for manufacturing a Si(1-v-w-x)CwAlxNv substrate 10a includes the following steps. First, a Si substrate 11 is prepared. A Si(1-v-w-x)CwAlxNv layer (0<v<1, 0<w<1, 0<x<1, and 0<v+w+x<1) is then grown on the Si substrate at a temperature below 550° C.
申请公布号 US2011039071(A1) 申请公布日期 2011.02.17
申请号 US20090989015 申请日期 2009.04.17
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD 发明人 SATOH ISSEI;MIYANAGA MICHIMASA;FUJIWARA SHINSUKE;NAKAHATA HIDEAKI
分类号 B32B3/00;C23C14/34;C30B23/06;C30B25/02 主分类号 B32B3/00
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