| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board and a method of manufacturing the same that minimize the separation of a circuit layer and reducing the lead time and the manufacturing cost. <P>SOLUTION: The printed circuit board includes a circuit pattern embedded in one surface of an insulating member 120, a build-up layer laminated on one surface of the insulating member 120, and including the circuit layer 144 formed in a build-up insulating layer 142 and having a via connected to the circuit pattern, and a solder resist layer 150 laminated on the build-up layer. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
