| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer ceramic substrate, wherein cracks can be prevented from occurring around an interlayer connecting conductor when carrying out a mechanical polishing, and the need for many steps is eliminated after the process of the mechanical polishing. SOLUTION: Firstly, the surface of a sintered compact body 37 is polished by a wrapping process until warpage or the like on the substrate is eliminated to secure the flatness of the substrate. Next, after the wrapping process, both of the outside surfaces of the sintered compact body 37 are polished by a polishing process. Specifically, both outside surfaces of the sintered compact body 37 after the wrapping process are polished by using polycrystal diamond abrasive grains 41 with an average particle diameter (D50) of 9μm. More specifically, the polycrystal diamond abrasive grains 41 larger in the average particle diameter (D50) than in the convex amount is selected, and the polishing is performed by using a polishing plate 43 for polishing with the polycrystal diamond abrasive grains 41 fixed thereon to obtain the multilayer ceramic substrate 1. COPYRIGHT: (C)2011,JPO&INPIT |
