SHEET-LIKE EPOXY RESIN COMPOSITION FOR SEALING ELECTRONIC PARTS, AND ELECTRONIC PARTS DEVICE ASSEMBLY OBTAINED FROM THE COMPOSITION, AND ELECTRONIC PARTS DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a sheet-like epoxy resin composition for sealing electronic parts, reducing the warpage of a board after sealing even if the sealing area is large, and to provide an electronic parts device assembly obtained by sealing the electronic parts installed on the board using the composition. SOLUTION: The sheet-like epoxy resin composition for sealing electronic parts is obtained by forming in a sheet-like manner an epoxy resin composition including the components (A) to (E): (A) an acetal group-containing epoxy resin; (B) a phenolic resin; (C) an elastomer; (D) an inorganic filler; and (E) an imidazole compound; wherein the content of the component (C) is 15-30 wt.% of the whole epoxy resin composition. The electronic parts device assembly obtained by sealing a plurality of electronic parts using the composition is also provided. COPYRIGHT: (C)2011,JPO&INPIT