| 摘要 |
PROBLEM TO BE SOLVED: To provide a self-adhesive tape which is superior in proper flexibility, has a superior cutting property especially when used for a dicing process for a wafer, and is free of problems associated with wafer dicing. SOLUTION: The film for the self-adhesive tape of a semiconductor manufacturing process contains a polyethylene-based resin, wherein its tensile modulus of elasticity is 50-350 MPa, its tensile rupture elongation is 200% or more, and its degree of cut resistance expressed by formula 1: (degree of cut resistance)=(tensile rupture strength of the film)/(tensile stress at 30% elongation of the film) is less than 2.5. COPYRIGHT: (C)2011,JPO&INPIT |
