发明名称 MOLDING METHOD OF FOAMING RESIN SUBSTRATE AND MOLD
摘要 PROBLEM TO BE SOLVED: To provide a molding method of a foaming resin substrate in a laminate molded article with a surface skin vacuum-stuck and a mold, which produce no sag of a shape in a vacuum hole peripheral part provided on the foaming resin substrate and enable a molding of a high accuracy. SOLUTION: The forming resin substrate 21 is molded by a steps of injection-filling a foaming resin material M to the inside of a cavity C formed by a cavity mold 50 and a core mold 60, thereafter, of carrying out a retreat operation of the cavity mold 50, and of carrying out a foaming reaction expanding a mold clearance to mold. A projection 63 for forming a vacuum hole projecting on the core mold 60 is shape-set in a tapered form considering a demolding inclination. Further, concavo-convex parts such as a ring-shaped projection 52, a rib 53, and a squeezing pattern 54 are formed on the mold surface of the cavity mold 50 corresponding to the projection 63 for forming the vacuum hole. By increasing the followability of a semi-molded article P at the time of the retreat operation of the cavity mold 50, the shape sag of the vacuum hole 23 peripheral part is suppressed and an appearance performance and a hand feeling of the laminate molded article 20 can be increased. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011031536(A) 申请公布日期 2011.02.17
申请号 JP20090181260 申请日期 2009.08.04
申请人 KASAI KOGYO CO LTD 发明人 HASHIMOTO SHINYA;HAYASHI YASUHIKO
分类号 B29C45/00;B29C45/14;B29C45/34;B29C45/37;B29C45/70;B29K105/04 主分类号 B29C45/00
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