发明名称 |
Ultraschall-Drahtbondingvorrichtung mit einer Einrichtung zum Prüfen einer Bondverbindung und Verfahren zum Prüfen einer mittels eines Ultraschall-Drahtbondingwerkzeugs hergestellten Bondverbindung |
摘要 |
<p>An ultrasonic wire bonder including apparatus for testing a bond includes a bonding tool ultrasonically driven for welding a wire on an underlying substrate and a clamp for holding the wire to be bonded by the bonding tool. The same clamp or other pulling apparatus moves the wire that has been bonded with a pre-established force to determine whether the bond will withstand the force. The accompanying method for testing a bond includes holding the wire after the bond has been made with the same holder and pulling the wire with a pre-established force substantially along the direction of the wire's longitudinal axis to determine the strength of the bond.</p> |
申请公布号 |
DE19752319(C5) |
申请公布日期 |
2011.02.17 |
申请号 |
DE1997152319 |
申请日期 |
1997.11.26 |
申请人 |
ORTHODYNE ELECTRONICS CORP. |
发明人 |
KELLY, GREGG S. |
分类号 |
H01R43/02;B23K20/00;B23K20/10;B23K31/12;G01N3/00;G01N3/08;H01L21/60 |
主分类号 |
H01R43/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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