发明名称 Ultraschall-Drahtbondingvorrichtung mit einer Einrichtung zum Prüfen einer Bondverbindung und Verfahren zum Prüfen einer mittels eines Ultraschall-Drahtbondingwerkzeugs hergestellten Bondverbindung
摘要 <p>An ultrasonic wire bonder including apparatus for testing a bond includes a bonding tool ultrasonically driven for welding a wire on an underlying substrate and a clamp for holding the wire to be bonded by the bonding tool. The same clamp or other pulling apparatus moves the wire that has been bonded with a pre-established force to determine whether the bond will withstand the force. The accompanying method for testing a bond includes holding the wire after the bond has been made with the same holder and pulling the wire with a pre-established force substantially along the direction of the wire's longitudinal axis to determine the strength of the bond.</p>
申请公布号 DE19752319(C5) 申请公布日期 2011.02.17
申请号 DE1997152319 申请日期 1997.11.26
申请人 ORTHODYNE ELECTRONICS CORP. 发明人 KELLY, GREGG S.
分类号 H01R43/02;B23K20/00;B23K20/10;B23K31/12;G01N3/00;G01N3/08;H01L21/60 主分类号 H01R43/02
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