PRINTED CIRCUIT BOARD AND FABRICATING METHOD OF THE SAME

摘要

PURPOSE: A printed circuit board and a fabricating method thereof are provided to prevent the deformation during the process progress by using the liquid polymer insulation layer having high reliability in the high temperature. CONSTITUTION: An internal layer circuit layer(308) including an internal layer via(306) formed on the inner wall of an inter layer via hole(304) is formed on a core insulating layer(302) of a core substrate. A liquid crystal polymer insulating layer(310) comprises the inside of the inter layer via hole. The liquid crystal polymer insulating layer is laminated on the core substrate.