| 发明名称 |
CONTACT AND SOCKET EQUIPPED WITH THE SAME |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a contact and a socket hardly peeling off at a soldering part. <P>SOLUTION: A first spring part 32 supporting an LED (light emitting diode) from below is provided on one end of the soldering part 31 soldered to a wiring board 24, and a second spring part 33 supporting the LED from above is provided on the other end of the soldering part 31. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
| 申请公布号 |
JP2011034914(A) |
申请公布日期 |
2011.02.17 |
| 申请号 |
JP20090182463 |
申请日期 |
2009.08.05 |
| 申请人 |
JAPAN AVIATION ELECTRONICS INDUSTRY LTD |
发明人 |
SUGANO SHUSEN;TAI TOMISHIGE |
| 分类号 |
H01R12/51;H01R12/55;H01R13/24;H01R33/74 |
主分类号 |
H01R12/51 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
