| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of flattening and burying metal in an insulating film with a slurry without using a polishing pad nor an abrasive grain. SOLUTION: Fine air bubbles (microbubbles) are dispersed in the slurry liquid, a metal film is deposited on a substrate where a pattern of size smaller than an average diameter of the fine air bubbles is formed, and the substrate having the metal film deposited is dipped in the slurry liquid in which the fine air bubbles are dispersed to flatten and bury the metal in the insulating film while leaving recessed parts of the deposited metal film. COPYRIGHT: (C)2011,JPO&INPIT
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