发明名称 |
Einrichtung zum Positionieren und Lageerhalten von |
摘要 |
<p>A device for positioning and holding thin substrates, especially silicon wafers (4), after cutting, preferably wire sawing, a substrate block (13) comprises a cassette (17) having at least two contact strips (20) facing the block-encompassing elements that engage in the narrow cutting gap (15) between the wafers. An independent claim is also included for a method of using the above device.</p> |
申请公布号 |
DE502006008686(D1) |
申请公布日期 |
2011.02.17 |
申请号 |
DE20065008686T |
申请日期 |
2006.05.26 |
申请人 |
SCHMID TECHNOLOGY SYSTEMS GMBH |
发明人 |
GENTISCHER, JOSEF;HABERMANN, DIRK |
分类号 |
B28D5/00;B23D57/00;H01L21/67 |
主分类号 |
B28D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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