| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting module which can improve heat dissipation from LEDs mounted to a substrate and can suppress the separation of a sealing resin from the module substrate caused by a heat cycle resulting from light emission and its suspension. <P>SOLUTION: A plurality of metal heat diffusion layers 6 and 7 are formed on part of the surface of the module substrate 2. Wiring conductors 16 and 17 are formed on the surface of the module substrate 2 where the wiring conductors 16 and 17 and the heat diffusion layers 6 and 7 jointly form irregularities. A plurality of LEDs 32 supplied with power through the wiring conductors are mounted on the heat diffusion layers 6 and 7. The module substrate 2 is coated with a translucent sealing resin 48, and the module substrate 2, the heat diffusion layers 6 and 7, wiring conductors 16 and 17, and LEDs 32 are embedded in the translucent sealing resin 48. <P>COPYRIGHT: (C)2011,JPO&INPIT |
