| 摘要 |
<p>In a conventional heat dissipating base body, when a supporting substrate and a circuit member are joined, the supporting substrate is greatly warped. In order to solve this problem, there is provided a heat dissipating base body (1) including a supporting substrate (2) having a first main surface and a second main surface facing the first main surface, a first intermediate layer located on the first main surface, a second intermediate layer located on the second main surface, a circuit member (22) located on the first intermediate layer, and a heat dissipating member (23) located on the second intermediate layer, at least one of the first intermediate layer and the second intermediate layer having an inner layer (31, 32) and an outer layer (41, 42) located away from the inner layer (31, 32) to the supporting substrate (2), and the inner layer (31, 32) having a melting point lower than that of the outer layer (41, 42).</p> |
