| 摘要 |
<p>The invention provides a light emitting diode (500). The light emitting diode (500) includes a ceramic substrate (200) having a first surface (202) and an opposite second surface (204). A first conductive trace metal layer (208a) and a second conductive trace metal layer (208b) are disposed on the first surface (202) of the ceramic substrate (200). At least one light emitting diode chip (206) is disposed on the first surface (202) of the ceramic substrate (200), respectively and electrically connected to the first and second conductive trace metal layers (208a,208b). A plurality of thermal metal pads (216) is disposed on the second surface (204) of the ceramic substrate (200), wherein the thermal metal pads (216) are electrically isolated from the light emitting diode chip (206).</p> |
