<p>The present invention relates to an electrolyte for the electrochemical deposition of palladium or palladium alloys on metallic or conductive substrates. The invention likewise relates to a corresponding electroplating process using this electrolyte and specific palladium salts which can be advantageously used in this process.</p>
申请公布号
EP2283170(A1)
申请公布日期
2011.02.16
申请号
EP20080758401
申请日期
2008.05.07
申请人
UMICORE GALVANOTECHNIK GMBH
发明人
BERGER, SASCHA;OBERST, FRANK;SIMON, FRANZ;MANZ, UWE;WEYHMUELLER, BERND;BRONDER, KLAUS