发明名称 THERMAL INTERFACE MATERIAL WITH THIN TRANSFER FILM OR METALLIZATION
摘要 <p>According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a metallization layer having a layer thickness of about 0.0005 inches or less. The metallization layer is disposed along at least a portion of the first side of the thermal interface material.</p>
申请公布号 EP2207674(A4) 申请公布日期 2011.02.16
申请号 EP20080874141 申请日期 2008.09.04
申请人 LAIRD TECHNOLOGIES, INC. 发明人 STRADER, JASON, L.;WISNIEWSKI, MARK;BRUZDA, KAREN, J.;CRAIG, MICHAEL, D.
分类号 B32B7/02;B05C5/00;B05D3/00;H01L23/373 主分类号 B32B7/02
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