发明名称 |
THERMAL INTERFACE MATERIAL WITH THIN TRANSFER FILM OR METALLIZATION |
摘要 |
<p>According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a metallization layer having a layer thickness of about 0.0005 inches or less. The metallization layer is disposed along at least a portion of the first side of the thermal interface material.</p> |
申请公布号 |
EP2207674(A4) |
申请公布日期 |
2011.02.16 |
申请号 |
EP20080874141 |
申请日期 |
2008.09.04 |
申请人 |
LAIRD TECHNOLOGIES, INC. |
发明人 |
STRADER, JASON, L.;WISNIEWSKI, MARK;BRUZDA, KAREN, J.;CRAIG, MICHAEL, D. |
分类号 |
B32B7/02;B05C5/00;B05D3/00;H01L23/373 |
主分类号 |
B32B7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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