发明名称 Metal gate transistor and method for fabricating the same
摘要 A method for fabricating a transistor having metal gate is disclosed. First, a substrate is provided, in which the substrate includes a first transistor region and a second transistor region. A plurality of dummy gates is formed on the substrate, and a dielectric layer is deposited on the dummy gate. The dummy gates are removed to form a plurality of openings in the dielectric layer. A high-k dielectric layer is formed to cover the surface of the dielectric layer and the opening, and a cap layer is formed on the high-k dielectric layer thereafter. The cap layer disposed in the second transistor region is removed, and a metal layer is deposited on the cap layer of the first transistor region and the high-k dielectric layer of the second transistor region. A conductive layer is formed to fill the openings of the first transistor region and the second transistor region.
申请公布号 US7888195(B2) 申请公布日期 2011.02.15
申请号 US20080198128 申请日期 2008.08.26
申请人 UNITED MICROELECTRONICS CORP. 发明人 LIN CHIEN-TING;CHENG LI-WEI;TSENG JUNG-TSUNG;HSU CHE-HUA;YU CHIH-HAO;CHIANG TIAN-FU;CHEN YI-WEN;LAI CHIEN-MING;CHOU CHENG-HSIEN
分类号 H01L21/8238 主分类号 H01L21/8238
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