发明名称 Method for direct heat sink attachment
摘要 A system and method of attaching a heat sink to an integrated circuit chip includes providing a compliant material for constraining the heat sink's mechanical motion while simultaneously allowing for thermal expansion of the heat sink.
申请公布号 US7888792(B2) 申请公布日期 2011.02.15
申请号 US20090535394 申请日期 2009.08.04
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHAINER TIMOTHY J
分类号 H01L23/10;H01L21/00 主分类号 H01L23/10
代理机构 代理人
主权项
地址