发明名称 Structures of high-voltage MOS devices with improved electrical performance
摘要 A semiconductor structure includes a first high-voltage well (HVW) region of a first conductivity type overlying a substrate, a second HVW region of a second conductivity type opposite the first conductivity type overlying the substrate and laterally adjoining the first HVW region, and a third HVW region of the second conductivity type underlying the second HVW region. A region underlying the first HVW region is substantially free from the third HVW region, wherein the third HVW region has a bottom lower than a bottom of the first HVW region. The semiconductor structure further includes an insulation region in a portion and extending from a top surface of the first HVW region into the first HVW region, a gate dielectric extending from over the first HVW region to over the second HVW region wherein the gate dielectric has a portion over the insulation region, and a gate electrode on the gate dielectric.
申请公布号 US7888767(B2) 申请公布日期 2011.02.15
申请号 US20060588902 申请日期 2006.10.26
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 HUANG KUN-MING;CHOU HSUEH-LIANG;CHU WENG-CHU;WU CHEN-BAU
分类号 H01L29/02 主分类号 H01L29/02
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