发明名称 |
Integrated multilayer chip capacitor module and integrated circuit apparatus having the same |
摘要 |
An integrated multilayer chip capacitor module including: plurality of multilayer chip capacitors arranged close to one another and co-planar with one another; and a capacitor support accommodating the multilayer chip capacitors, wherein each of the multilayer chip capacitors includes a rectangular parallelepiped capacitor body and a plurality of first and second external electrodes formed on at least two sides of the capacitor body, and the external electrodes on adjacent sides of adjacent ones of the multilayer chip capacitor in the capacitor support are electrically connected to each other by a conductive adhesive material. |
申请公布号 |
US7889479(B2) |
申请公布日期 |
2011.02.15 |
申请号 |
US20080007737 |
申请日期 |
2008.01.15 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE BYOUNG HWA;WI SUNG KWON;PARK SANG SOO;PARK MIN CHEOL;PARK DONG SEOK |
分类号 |
H01G4/228 |
主分类号 |
H01G4/228 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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