| 摘要 |
PURPOSE:To enable to prevent the press-bonding removal of wires by restriction of the flow of solder for connecting a semiconductor pellet by a method wherein the titled device is formed so that a part of connect the wires from the ground electrode to a tab and a header, heat dissipating members, may become higher in position. CONSTITUTION:Of the semiconductor device with a semiconductor element 2 connected on a metallic heat dissipating member 1 via solder 7, and with the ground electrode of the element 2 connected to the member 1 via metallic wires 3, the member is formed in unevenness in such a manner that the section of the member where the wire is connected become higher in position than that where the element is connected. For example, the tab is provided with an Ag film of good wetting property with solder over its entire surface, and the ground electrode of the semiconductor pellet 2 is connected to the projecting upper part of the tab by wire bonding with the Au wire 3. With such a lead frame the solder layer 7 to connect the pellet to the tab does not stretch around because of the part 8 projected out of part of the tab, and then bonding the ground electrode wire to the top of the projection having no solder enables the prevention of press-bonding removal. |
