| 摘要 |
There are provided a wafer stage and methods for chucking a wafer using the same. The wafer stage includes a wafer chuck adapted to hold a wafer; lift pins adapted to pass through the wafer chuck, move vertically, and support the wafer; and an air expulsion unit adapted to expel air towards an edge of the wafer. The method for attaching a wafer to a wafer chuck comprises lowering lift pins supporting the wafer; and expelling air towards an edge of the wafer using an air expulsion unit.
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