发明名称 |
Apparatus for testing a semiconductor device and a method of fabricating and using the same |
摘要 |
Example embodiments provide for an apparatus for testing various kinds of semiconductor devices having different distances between probes. Example embodiments also provide for a method of fabricating and using said apparatus. In accordance with example embodiments, an apparatus for testing a semiconductor device may include at least one cable penetrating a plate and extending from a surface of the plate. The at least one cable may include at least one signal line and at least one ground line. The apparatus may also include a pair of probes connected to the at least one signal line and configured to contact a first pad of a semiconductor device and a second pad of the semiconductor device. In accordance with example embodiments, the apparatus for testing a semiconductor device may also include a control unit on the surface of the plate configured to control a distance between the pair of probes.
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申请公布号 |
US7888956(B2) |
申请公布日期 |
2011.02.15 |
申请号 |
US20080232449 |
申请日期 |
2008.09.17 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE HYUN-AE;KIM DONG-DAE;KIM HOON-JUNG |
分类号 |
G01R31/02 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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