发明名称 Apparatus for testing a semiconductor device and a method of fabricating and using the same
摘要 Example embodiments provide for an apparatus for testing various kinds of semiconductor devices having different distances between probes. Example embodiments also provide for a method of fabricating and using said apparatus. In accordance with example embodiments, an apparatus for testing a semiconductor device may include at least one cable penetrating a plate and extending from a surface of the plate. The at least one cable may include at least one signal line and at least one ground line. The apparatus may also include a pair of probes connected to the at least one signal line and configured to contact a first pad of a semiconductor device and a second pad of the semiconductor device. In accordance with example embodiments, the apparatus for testing a semiconductor device may also include a control unit on the surface of the plate configured to control a distance between the pair of probes.
申请公布号 US7888956(B2) 申请公布日期 2011.02.15
申请号 US20080232449 申请日期 2008.09.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE HYUN-AE;KIM DONG-DAE;KIM HOON-JUNG
分类号 G01R31/02 主分类号 G01R31/02
代理机构 代理人
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