发明名称 |
Electrical connections for multichip modules |
摘要 |
A semiconductor package includes a first semiconductor chip mounted on a substrate and a second semiconductor chip mounted on top of the first semiconductor chip. The first chip includes a plurality of metal lines which may be deposited at its top surface, and the metal lines are isolated from circuitry in the first chip. Wire bonds connect pads on the second chip to metal lines on the first chip. Additional wired bonds connect the metal lines on the first chip to terminals on the substrate. Conductive through-silicon vias or solder bumps may replace the wire bonds, and additional chips may be included in the package.
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申请公布号 |
US7888806(B2) |
申请公布日期 |
2011.02.15 |
申请号 |
US20080032430 |
申请日期 |
2008.02.15 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE SEOK-CHAN;KIM MIN-WOO |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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