| 发明名称 |
Aromatic polyamide and epoxy group-containing phenoxy resin |
| 摘要 |
A polyamide resin composition which can improve heat resistance and water absorbency while suppressing the deterioration of processability is provided. Provided is a polyamide resin composition having an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule of the phenoxy resin, wherein the content of the epoxy group-containing phenoxy resin is 30 to 50% by mass.
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| 申请公布号 |
US7888434(B2) |
申请公布日期 |
2011.02.15 |
| 申请号 |
US20060915069 |
申请日期 |
2006.05.17 |
| 申请人 |
NITTO SHINKO CORPORATION;E. I. DU PONT DE NEMOURS AND COMPANY;DUPONT TEIJIN ADVANCED PAPERS (JAPAN) |
发明人 |
KIHARA YASUYUKI;TAKAHASHI YOSHIKI;TAKAYAMA HIDENORI;IMAI MASANORI;TANAKA YASUNORI;NARUSE SHINJI;ANDERSON DAVID WAYNE |
| 分类号 |
C08L63/02;C08L77/10 |
主分类号 |
C08L63/02 |
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