发明名称 Electronic component, production method of electronic component, mounted structure of electronic component, and evaluation method of electronic component
摘要 An electronic component having an element body having at least one plane, and a terminal electrode to be electrically connected through an electroconductive particle to a circuit substrate. The terminal electrode is formed on the plane of the element body. When the plane of the element body is defined as a reference plane, a ratio of a projected area onto the reference plane of an external surface of the terminal electrode opposed to the circuit substrate in a region where a height of the terminal electrode from the reference plane is not less than a value resulting from subtraction of a diameter of the electroconductive particle from a maximum of the height, to a projected area onto the reference plane of the external surface of the terminal electrode opposed to the circuit substrate is set to be not less than 10%.
申请公布号 US7888182(B2) 申请公布日期 2011.02.15
申请号 US20070715345 申请日期 2007.03.08
申请人 TDK CORPORATION 发明人 ONODERA SHINYA;TSURUOKA MIKIO
分类号 H01L21/00 主分类号 H01L21/00
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