发明名称 |
Electronic component, production method of electronic component, mounted structure of electronic component, and evaluation method of electronic component |
摘要 |
An electronic component having an element body having at least one plane, and a terminal electrode to be electrically connected through an electroconductive particle to a circuit substrate. The terminal electrode is formed on the plane of the element body. When the plane of the element body is defined as a reference plane, a ratio of a projected area onto the reference plane of an external surface of the terminal electrode opposed to the circuit substrate in a region where a height of the terminal electrode from the reference plane is not less than a value resulting from subtraction of a diameter of the electroconductive particle from a maximum of the height, to a projected area onto the reference plane of the external surface of the terminal electrode opposed to the circuit substrate is set to be not less than 10%.
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申请公布号 |
US7888182(B2) |
申请公布日期 |
2011.02.15 |
申请号 |
US20070715345 |
申请日期 |
2007.03.08 |
申请人 |
TDK CORPORATION |
发明人 |
ONODERA SHINYA;TSURUOKA MIKIO |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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