| 摘要 |
PURPOSE: A cleaning composition for the removal of lead-free soldering flux is provided to ensure excellent detergency for lead-free soldering flux attached to materials and to prevent the corrosion of wiring, including aluminum and/or copper. CONSTITUTION: A cleaning composition for the removal of lead-free soldering flux comprises (a) 1-20 weight% of azole-based compound, (b) 1-90 weight% of tetrahydrofurfuryl alcohol represented by chemical formula 1, and (c) 1-20 weight% of non-halogen organic solvents. The non-halogen organic solvents are a single or two or more kinds selected from the group consisting of a hydrocarbon-based solvent, alcoholic solvent, ketone-based solvent, ether-based solvent, ester-based solvent, nitrogen-containing compound-based solvent, and alkanolamine-based solvent. |
