发明名称 Semiconductor device and method of fabricating the same
摘要 A semiconductor device includes a semiconductor substrate; a first impurity diffusion suppression layer and a thicker second impurity diffusion suppression layer formed on the semiconductor substrate in first and second isolated transistor regions; first and second crystal layers formed on the first and second impurity diffusion suppression layers; first and second gate electrodes formed on the first and second crystal layers; first and second p-type channel regions formed in the semiconductor substrate, the first impurity diffusion suppression layer and respective of the first and second crystal layers below the first and second gate electrodes; and first and second source/drain regions formed on both sides of the first and second channel region; wherein the first and second p-type channels have lower impurity concentrations in respective of the first and second crystal layers than in the semiconductor substrate.
申请公布号 US7888747(B2) 申请公布日期 2011.02.15
申请号 US20090421203 申请日期 2009.04.09
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 HOKAZONO AKIRA
分类号 H01L27/088 主分类号 H01L27/088
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